Silver-Coated Copper Powder (Ag@Cu)

Ag@Cu powder pairs a low-cost copper core with a thin silver shell, delivering most of silver's surface conductivity and oxidation resistance at a fraction of the cost of solid silver powder.

8-15 wt% AgCoating Content
1-13 µmParticle Size Range
Custom Made-to-OrderGrade, Size & Quantity
WorldwideExport Shipping

Silver-Coated Copper Powder — Grades & Specifications

Silver-Coated Copper Powder (Ag@Cu) powder is supplied across a range of grades, particle sizes and coating ratios. The options below are typical; specify your target values in the request form and we will confirm availability, lead time and pricing.

MaterialSilver-Coated Copper Powder (Ag@Cu)
CategoryMetal-Coated Powder
Core materialCopper (CAS 7440-50-8)
Coating / shell materialSilver (CAS 7440-22-4)
Coating contentTypically 5-35 wt% Ag; a commonly cited functional/stability-optimized range is 8-15 wt% Ag (above ~15 wt% Ag, free silver can form on the surface and reduce coating stability)
Particle sizeCommonly 1-13 um APS across commercial grades (e.g. 1-3, 3-5, 5-10 um); nano grades of roughly 20 nm Cu core / 300 nm Ag shell are also available
MorphologyDendritic, flaky or spherical depending on production route (physically produced Cu cores give a smoother spherical Ag coating; chemically produced cores give irregular/polyhedral particles)
AppearanceGrayish-brown to silver-gray free-flowing powder
Oxidation Resistance & ConductivityThe silver shell suppresses native copper oxidation and stabilizes conductivity versus bare copper powder, giving most of silver's surface conductivity at a fraction of the cost
Typical applicationsConductive Adhesives & Pastes, EMI/RFI Shielding Compounds, Printed Circuit Board Manufacturing, Photovoltaic Cell Metallization

Applications by Industry

Conductive Adhesives & PastesLow-cost, high-conductivity filler replacing pure silver powder in electrically conductive adhesives.
EMI/RFI Shielding CompoundsUsed in conductive paints, plastics and rubbers to block electromagnetic interference.
Printed Circuit Board ManufacturingProvides solderable, oxidation-resistant conductive traces and pastes.
Photovoltaic Cell MetallizationCost-reduced alternative to solid silver in solar cell front/back contact pastes.
Electronic Packaging InterconnectsUsed in die-attach and interconnect materials for semiconductor packaging.
Antibacterial & Catalytic CoatingsLeverages silver surface chemistry in catalysis and antimicrobial composite applications.

Particle Size & Mesh Conversion

Reference for converting between US mesh and microns/millimetres. Figures are nominal sieve openings and may vary slightly by standard.

Mesh (US)Micron (µm)mmInchRemarks
367306.7300.2650
447604.7600.1870
540004.0000.1570
633603.3600.1320
728302.8300.1110
823802.3800.0937
1020002.0000.0787
1216801.6800.0661
1414101.4100.0555
1611901.1900.0469
1810001.0000.0394
208410.8410.0331
257070.7070.0278
305950.5950.0234
355000.5000.0197
404200.4200.0165
453540.3540.0138
502970.2970.0117
602500.2500.0098
702100.2100.0083
801770.1770.0070
1001490.1490.0059
1201250.1250.0049
1401050.1050.0041
1000.1000.0039Sand
170880.0880.0035
200740.0740.0029
700.0700.0027
230630.0630.0024Human hair
550.0550.00217
270530.0530.0021
500.0500.00197
325440.0440.0017
400.0400.00157
400370.0370.0015
550250.0250.00099
625200.0200.00079
1200120.0120.0005
1250100.0100.000394
70.0070.000276
250050.0050.000197
480030.0030.000118
50002.50.00250.000099Bacteria (approx.)
1200010.0010.0000394

Information Required for Quotation

  • Grade or type
  • Particle size (micron or mesh)
  • Coating content / core-shell ratio
  • Quantity
  • Application environment
  • Required delivery country
Lead time depends on grade, particle size, quantity and processing requirements. Export availability can be reviewed based on destination country and material type. A Certificate of Analysis can be provided on request.

Request a Quote or Custom Order

Tell us your grade, particle size and quantity. We typically reply within one business day.

Or email us directly at sales@koreanewmaterials.com · +82-2-599-3209

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Frequently Asked Questions

What is the coating content of Silver-Coated Copper Powder?
Typically 5-35 wt% Ag; a commonly cited functional/stability-optimized range is 8-15 wt% Ag (above ~15 wt% Ag, free silver can form on the surface and reduce coating stability) Other coating ratios can be reviewed on request depending on your application and quantity.
What particle sizes can you supply?
Commonly 1-13 um APS across commercial grades (e.g. 1-3, 3-5, 5-10 um); nano grades of roughly 20 nm Cu core / 300 nm Ag shell are also available Mesh-based requirements are also accepted; a mesh-to-micron conversion reference is provided on the page.
Can Silver-Coated Copper Powder be made to custom specifications?
Yes. Silver-Coated Copper Powder is produced to order — core/shell ratio, particle size, morphology and packaging can be customized to your specification. Select “Custom Order” in the request form and provide your target values.
What is the minimum order quantity (MOQ)?
Order quantity is flexible and small quantities and prototype requests are welcome. Please state your required quantity in the form for an accurate quotation.
Can you export and ship Silver-Coated Copper Powder internationally?
Yes, export inquiries are welcome. Availability and shipping are reviewed based on destination country, grade and quantity.
Do you provide a Certificate of Analysis (COA) or technical data?
A Certificate of Analysis and technical data can be provided on request for supplied lots.

Related Products

Request a Quote for Silver-Coated Copper Powder

Send us your grade, particle size, quantity and application. We will review availability, quotation and lead time. Small quantities, prototypes and custom made-to-order specifications are welcome.

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