Silicone-Coated Silica Filler (Silane@SiO2)
Silane@SiO2 filler is spherical fused silica surface-treated with a silane coupling agent, giving the high loading, low viscosity and strong resin adhesion required in epoxy molding compounds for semiconductor chip packaging.
Silane surface treatmentCoating Content
D50 1-10 µmParticle Size Range
Custom Made-to-OrderGrade, Size & Quantity
WorldwideExport Shipping
Silicone-Coated Silica Filler — Grades & Specifications
Silicone-Coated Silica Filler (Silane@SiO2) powder is supplied across a range of grades, particle sizes and coating ratios. The options below are typical; specify your target values in the request form and we will confirm availability, lead time and pricing.
| Material | Silicone-Coated Silica Filler (Silane@SiO2) |
|---|---|
| Category | Polymer-Coated Powder |
| Core material | Fused (amorphous) silica (CAS 60676-86-0) |
| Coating / shell material | Silane coupling agent (e.g. epoxy- or amino-functional silane) (CAS 2530-83-8) |
| Coating content | Silane surface treatment typically well under a few wt% relative to filler mass; exact loading is formulation-dependent and confirmed on request |
| Particle size | Application-dependent: standard EMC grades D50 approximately 5-10 um, fine-pitch grades D50 approximately 3-6 um, ultra-fine/wafer-level grades D50 approximately 1-3 um |
| Morphology | Spherical (preferred over angular crystalline silica for lower viscosity and better flow in molding compounds) |
| Appearance | White to off-white free-flowing powder |
| Packaging Performance | Particle size distribution controls packing density and viscosity in transfer molding, while the silane treatment improves resin-filler interfacial adhesion and moisture resistance of the cured semiconductor package |
| Typical applications | IC / Chip Encapsulation Molding Compound, BGA & Flip-Chip Underfill/Overmold, QFP/SOP Leadframe Package Encapsulation, Wafer-Level & Fan-Out Packaging |
Applications by Industry
IC / Chip Encapsulation Molding CompoundBulk filler at high loading in epoxy molding compounds for semiconductor packages.
BGA & Flip-Chip Underfill/OvermoldFine D50 grades enable flow through narrow gaps in advanced packages.
QFP/SOP Leadframe Package EncapsulationStandard D50 filler used in high-volume discrete and IC packaging.
Wafer-Level & Fan-Out PackagingUltra-fine D50 grades for thin, high-density redistribution layers.
Low-CTE Structural FillerMatches expansion coefficient of silicon die to reduce package warpage.
High-Voltage Potting CompoundsSilane-treated silica used as electrically insulating structural filler in power electronics encapsulation.
Particle Size & Mesh Conversion
Reference for converting between US mesh and microns/millimetres. Figures are nominal sieve openings and may vary slightly by standard.
| Mesh (US) | Micron (µm) | mm | Inch | Remarks |
|---|---|---|---|---|
| 3 | 6730 | 6.730 | 0.2650 | |
| 4 | 4760 | 4.760 | 0.1870 | |
| 5 | 4000 | 4.000 | 0.1570 | |
| 6 | 3360 | 3.360 | 0.1320 | |
| 7 | 2830 | 2.830 | 0.1110 | |
| 8 | 2380 | 2.380 | 0.0937 | |
| 10 | 2000 | 2.000 | 0.0787 | |
| 12 | 1680 | 1.680 | 0.0661 | |
| 14 | 1410 | 1.410 | 0.0555 | |
| 16 | 1190 | 1.190 | 0.0469 | |
| 18 | 1000 | 1.000 | 0.0394 | |
| 20 | 841 | 0.841 | 0.0331 | |
| 25 | 707 | 0.707 | 0.0278 | |
| 30 | 595 | 0.595 | 0.0234 | |
| 35 | 500 | 0.500 | 0.0197 | |
| 40 | 420 | 0.420 | 0.0165 | |
| 45 | 354 | 0.354 | 0.0138 | |
| 50 | 297 | 0.297 | 0.0117 | |
| 60 | 250 | 0.250 | 0.0098 | |
| 70 | 210 | 0.210 | 0.0083 | |
| 80 | 177 | 0.177 | 0.0070 | |
| 100 | 149 | 0.149 | 0.0059 | |
| 120 | 125 | 0.125 | 0.0049 | |
| 140 | 105 | 0.105 | 0.0041 | |
| — | 100 | 0.100 | 0.0039 | Sand |
| 170 | 88 | 0.088 | 0.0035 | |
| 200 | 74 | 0.074 | 0.0029 | |
| — | 70 | 0.070 | 0.0027 | |
| 230 | 63 | 0.063 | 0.0024 | Human hair |
| — | 55 | 0.055 | 0.00217 | |
| 270 | 53 | 0.053 | 0.0021 | |
| — | 50 | 0.050 | 0.00197 | |
| 325 | 44 | 0.044 | 0.0017 | |
| — | 40 | 0.040 | 0.00157 | |
| 400 | 37 | 0.037 | 0.0015 | |
| 550 | 25 | 0.025 | 0.00099 | |
| 625 | 20 | 0.020 | 0.00079 | |
| 1200 | 12 | 0.012 | 0.0005 | |
| 1250 | 10 | 0.010 | 0.000394 | |
| — | 7 | 0.007 | 0.000276 | |
| 2500 | 5 | 0.005 | 0.000197 | |
| 4800 | 3 | 0.003 | 0.000118 | |
| 5000 | 2.5 | 0.0025 | 0.000099 | Bacteria (approx.) |
| 12000 | 1 | 0.001 | 0.0000394 |
Information Required for Quotation
- Grade or type
- Particle size (micron or mesh)
- Coating content / core-shell ratio
- Quantity
- Application environment
- Required delivery country
Lead time depends on grade, particle size, quantity and processing requirements. Export availability can be reviewed based on destination country and material type. A Certificate of Analysis can be provided on request.
Request a Quote or Custom Order
Tell us your grade, particle size and quantity. We typically reply within one business day.
Frequently Asked Questions
What is the coating content of Silicone-Coated Silica Filler?
Silane surface treatment typically well under a few wt% relative to filler mass; exact loading is formulation-dependent and confirmed on request Other coating ratios can be reviewed on request depending on your application and quantity.
What particle sizes can you supply?
Application-dependent: standard EMC grades D50 approximately 5-10 um, fine-pitch grades D50 approximately 3-6 um, ultra-fine/wafer-level grades D50 approximately 1-3 um Mesh-based requirements are also accepted; a mesh-to-micron conversion reference is provided on the page.
Can Silicone-Coated Silica Filler be made to custom specifications?
Yes. Silicone-Coated Silica Filler is produced to order — core/shell ratio, particle size, morphology and packaging can be customized to your specification. Select “Custom Order” in the request form and provide your target values.
What is the minimum order quantity (MOQ)?
Order quantity is flexible and small quantities and prototype requests are welcome. Please state your required quantity in the form for an accurate quotation.
Can you export and ship Silicone-Coated Silica Filler internationally?
Yes, export inquiries are welcome. Availability and shipping are reviewed based on destination country, grade and quantity.
Do you provide a Certificate of Analysis (COA) or technical data?
A Certificate of Analysis and technical data can be provided on request for supplied lots.
Related Products
Request a Quote for Silicone-Coated Silica Filler
Send us your grade, particle size, quantity and application. We will review availability, quotation and lead time. Small quantities, prototypes and custom made-to-order specifications are welcome.