Parylene-Coated Solder Powder (Parylene@Solder)

Parylene@Solder powder carries a vapor-deposited, pinhole-free conformal coating that is thin enough to melt away cleanly during reflow while protecting the solder particles from oxidation and moisture during storage.

0.005-0.025 wt%Coating Content
5-45 µm (Type 3-6)Particle Size Range
Custom Made-to-OrderGrade, Size & Quantity
WorldwideExport Shipping

Parylene-Coated Solder Powder — Grades & Specifications

Parylene-Coated Solder Powder (Parylene@Solder) powder is supplied across a range of grades, particle sizes and coating ratios. The options below are typical; specify your target values in the request form and we will confirm availability, lead time and pricing.

MaterialParylene-Coated Solder Powder (Parylene@Solder)
CategoryPolymer-Coated Powder
Core materialSolder alloy (e.g. Sn63/Pb37 eutectic or lead-free SAC alloys)
Coating / shell materialParylene (poly-para-xylylene) conformal coating (CAS 1633-22-3)
Coating contentExtremely thin — typically 0.001-0.2 wt%, with 0.005-0.025 wt% most commonly used
Particle sizeGraded by industry Type per J-STD-005: Type 3 approximately 25-45 um, Type 4 approximately 20-38 um, Type 5 approximately 15-25 um, Type 6 approximately 5-15 um
MorphologySpherical (preferred for paste printability); amorphous/irregular shapes also usable
AppearanceBright metallic gray spherical powder, visually near-identical to uncoated solder powder since the coating is sub-micron
Shelf LifeParylene-coated solder pastes demonstrate shelf life commonly exceeding 6 months to over a year with viscosity increase typically held under 30% over that period, versus uncoated solder powder which oxidizes and reacts with paste flux far faster
Typical applicationsSMT Solder Paste for Stencil Printing, Fine-Pitch BGA/CSP Reflow Assembly, No-Clean Solder Paste Formulations, Long-Distance / Export Electronics Manufacturing

Applications by Industry

SMT Solder Paste for Stencil PrintingExtends usable shelf life of paste jars and cartridges before oxidation degrades print quality.
Fine-Pitch BGA/CSP Reflow AssemblyThin oxide-free coating supports consistent wetting on small-pad, fine-pitch components.
No-Clean Solder Paste FormulationsCoating reduces flux-metal side reactions, supporting low-residue no-clean chemistry stability.
Long-Distance / Export Electronics ManufacturingExtended shelf-stable paste tolerates longer shipping and storage before use.
Automated Dispensing & Jet-Printing PasteStable viscosity over time keeps dispense volume consistent in automated lines.
Rework & Repair Solder PasteLow-turnover inventory benefits from oxidation resistance during intermittent, infrequent use.

Particle Size & Mesh Conversion

Reference for converting between US mesh and microns/millimetres. Figures are nominal sieve openings and may vary slightly by standard.

Mesh (US)Micron (µm)mmInchRemarks
367306.7300.2650
447604.7600.1870
540004.0000.1570
633603.3600.1320
728302.8300.1110
823802.3800.0937
1020002.0000.0787
1216801.6800.0661
1414101.4100.0555
1611901.1900.0469
1810001.0000.0394
208410.8410.0331
257070.7070.0278
305950.5950.0234
355000.5000.0197
404200.4200.0165
453540.3540.0138
502970.2970.0117
602500.2500.0098
702100.2100.0083
801770.1770.0070
1001490.1490.0059
1201250.1250.0049
1401050.1050.0041
1000.1000.0039Sand
170880.0880.0035
200740.0740.0029
700.0700.0027
230630.0630.0024Human hair
550.0550.00217
270530.0530.0021
500.0500.00197
325440.0440.0017
400.0400.00157
400370.0370.0015
550250.0250.00099
625200.0200.00079
1200120.0120.0005
1250100.0100.000394
70.0070.000276
250050.0050.000197
480030.0030.000118
50002.50.00250.000099Bacteria (approx.)
1200010.0010.0000394

Information Required for Quotation

  • Grade or type
  • Particle size (micron or mesh)
  • Coating content / core-shell ratio
  • Quantity
  • Application environment
  • Required delivery country
Lead time depends on grade, particle size, quantity and processing requirements. Export availability can be reviewed based on destination country and material type. A Certificate of Analysis can be provided on request.

Request a Quote or Custom Order

Tell us your grade, particle size and quantity. We typically reply within one business day.

Or email us directly at sales@koreanewmaterials.com · +82-2-599-3209

Thank you — your request has been prepared. If your email client did not open, please email sales@koreanewmaterials.com.

Frequently Asked Questions

What is the coating content of Parylene-Coated Solder Powder?
Extremely thin — typically 0.001-0.2 wt%, with 0.005-0.025 wt% most commonly used Other coating ratios can be reviewed on request depending on your application and quantity.
What particle sizes can you supply?
Graded by industry Type per J-STD-005: Type 3 approximately 25-45 um, Type 4 approximately 20-38 um, Type 5 approximately 15-25 um, Type 6 approximately 5-15 um Mesh-based requirements are also accepted; a mesh-to-micron conversion reference is provided on the page.
Can Parylene-Coated Solder Powder be made to custom specifications?
Yes. Parylene-Coated Solder Powder is produced to order — core/shell ratio, particle size, morphology and packaging can be customized to your specification. Select “Custom Order” in the request form and provide your target values.
What is the minimum order quantity (MOQ)?
Order quantity is flexible and small quantities and prototype requests are welcome. Please state your required quantity in the form for an accurate quotation.
Can you export and ship Parylene-Coated Solder Powder internationally?
Yes, export inquiries are welcome. Availability and shipping are reviewed based on destination country, grade and quantity.
Do you provide a Certificate of Analysis (COA) or technical data?
A Certificate of Analysis and technical data can be provided on request for supplied lots.

Related Products

Request a Quote for Parylene-Coated Solder Powder

Send us your grade, particle size, quantity and application. We will review availability, quotation and lead time. Small quantities, prototypes and custom made-to-order specifications are welcome.

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